公开(公告)号：US11732160B2

公开(公告)日：2023-08-22

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chun-Chi Hsu ,  Chun-Ting Lai ,  Chih-Wei Lin

IPC: C09J7/38 ,  C09J7/25 ,  H01L33/00

CPC classification number: C09J7/38 ,  C09J7/25 ,  C09J7/383 ,  C09J7/385 ,  H01L33/0095 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2301/312 ,  C09J2433/00 ,  C09J2479/086

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.