专利检索 ap:("TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.") AND inv:"He-Hui Peng" 第 1 页

1.

发明授权
Mechanisms for removing debris from polishing pad 有权

公开(公告)号：US09630295B2

公开(公告)日：2017-04-25

申请号：US13944353

申请日：2013-07-17

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： He-Hui Peng , Fu-Ming Huang , Shich-Chang Suen , Han-Hsin Kuo , Chi-Ming Tsai , Liang-Guang Chen

IPC分类号： B24B53/017 , H01L21/304 , B08B3/02

CPC分类号： B24B53/017 , B08B3/02 , H01L21/304

摘要： Embodiments of mechanisms for performing a chemical mechanical polishing (CMP) process are provided. A method for performing a CMP process includes polishing a wafer by using a polishing pad. The method also includes applying a cleaning liquid jet on the polishing pad to condition the polishing pad. A CMP system is also provided.