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公开(公告)号：US10328549B2
公开(公告)日：2019-06-25
申请号：US14103629
申请日：2013-12-11
发明人： Shu-Bin Hsu , Ren-Guei Lin , Feng-Inn Wu , Sheng-Chen Wang , Jung-Yu Li
摘要： A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.
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公开(公告)号：US11407083B2
公开(公告)日：2022-08-09
申请号：US16449855
申请日：2019-06-24
发明人： Shu-Bin Hsu , Ren-Guei Lin , Feng-Inn Wu , Sheng-Chen Wang , Jung-Yu Li
摘要： A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.
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公开(公告)号：US12128522B2
公开(公告)日：2024-10-29
申请号：US17871259
申请日：2022-07-22
发明人： Shu-Bin Hsu , Ren-Guei Lin , Feng-Inn Wu , Sheng-Chen Wang , Jung-Yu Li
摘要： A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.
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