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公开(公告)号：US11031266B2
公开(公告)日：2021-06-08
申请号：US16449156
申请日：2019-06-21
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Chih-Hung Liao , Shiao-Ching Wu , Jun-Xiu Liu
IPC: H01L21/68 , H01L21/67 , H01L21/677
Abstract: A method includes disposing a wafer carrier onto a load port; detecting, by a first sensor in the wafer carrier, an elevation of a slot in the wafer carrier; adjusting an elevation of a wafer transferring device according to the detected elevation of the slot; and moving, at the adjusted elevation of the wafer transferring device, a wafer to the slot by the wafer transferring device.
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