Semiconductor device and manufacturing method thereof
    2.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US09337229B2

    公开(公告)日:2016-05-10

    申请号:US14244562

    申请日:2014-04-03

    IPC分类号: H01L27/146

    摘要: A semiconductor device includes an epitaxial layer including a first surface and a silicon layer disposed on the first surface and including a second surface opposite to the first surface, wherein the silicon layer includes a plurality of pillars on the second surface, a portion of the plurality of pillars on a predetermined portion of the second surface are in substantially same dimension, each of the plurality of pillars on the predetermined portion of the second surface stands substantially orthogonal to the second surface, the plurality of pillars are configured for absorbing an electromagnetic radiation of a predetermined wavelength projected from the epitaxial layer and generating an electrical energy in response to the absorption of the electromagnetic radiation.

    摘要翻译: 半导体器件包括外延层,其包括设置在第一表面上的第一表面和硅层,并且包括与第一表面相对的第二表面,其中硅层在第二表面上包括多个柱,多个部分 在第二表面的预定部分上的支柱的尺寸基本相同,第二表面的预定部分上的多个支柱中的每个支柱大致垂直于第二表面,多个支柱被构造成用于吸收第二表面的电磁辐射 从外延层投影的预定波长并且响应于电磁辐射的吸收而产生电能。