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公开(公告)号:US20200181402A1
公开(公告)日:2020-06-11
申请号:US16277069
申请日:2019-02-15
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor: SHUR-FEN LIU , CHIN-HSIEN HUNG
Abstract: A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 1 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.
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公开(公告)号:US20250163269A1
公开(公告)日:2025-05-22
申请号:US18426971
申请日:2024-01-30
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor: TSUNG-HSIEN LIN , SHUR-FEN LIU
Abstract: A resin composition is provided. The resin composition comprises: (A) an epoxy resin; (B) a maleimide-triazine resin; and (C) a first flame retardant having a structure of formula (I): wherein, Ar is a C3 to C18 heteroaryl or a C6 to C18 aryl; R1 is H or a C1 to C18 alkyl; and R2 and R3 are independently H, a C1 to C18 alkyl, a C3 to C18 heteroaryl, or a C6 to C18 aryl.
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3.
公开(公告)号:US20210380792A1
公开(公告)日:2021-12-09
申请号:US17078615
申请日:2020-10-23
Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
Inventor: SHUR-FEN LIU , SHI-ING HUANG
IPC: C08L27/18 , C08K7/14 , C08K3/40 , C08L27/14 , C08L27/16 , C08K3/016 , C08J5/24 , C08J5/18 , B32B27/30 , B32B15/082 , H05K1/03 , H05K1/05
Abstract: A fluororesin composition is provided. The fluororesin composition comprises the following constituents: (A) a first fluororesin, which is polytetrafluoroethylene (PTFE) resin; (B) a first filler, which is a flat glass fiber; and (C) particles of a second fluororesin, which are coated with polysiloxane, wherein, the particle size of the polysiloxane-coated particles of second fluororesin ranges from 0.2 μm to 80 μm, and the melting point of the second fluororesin is lower than the melting point of the first fluororesin.
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