RUBBER COMPOSITION AND TIRE
    1.
    发明公开

    公开(公告)号:US20240182697A1

    公开(公告)日:2024-06-06

    申请号:US18282920

    申请日:2021-12-06

    发明人: Ryota SONE

    摘要: Provided is a rubber composition that can achieve excellent on-ice performance and steering stability when used in tires. A rubber composition comprises: a rubber component containing an isoprene-based rubber, and a modified conjugated diene-based polymer that is a reaction product of a conjugated diene-based polymer having an active terminal and a compound [M] containing a total of two or more of at least one selected from a group “—CR1═N-A1” and a group “—N═CR1-A1”, where R1 is a hydrogen atom or a hydrocarbyl group and A1 is a monovalent group having an alkoxysilyl group; a filler containing at least silica; and 5 parts by mass or more of a thermoplastic resin with respect to 100 parts by mass of the rubber component.

    POLYMERIC SUBSTRATE INCLUDING A BARRIER LAYER

    公开(公告)号:US20230407071A1

    公开(公告)日:2023-12-21

    申请号:US18239139

    申请日:2023-08-29

    IPC分类号: C08L23/12 C08L47/00

    CPC分类号: C08L23/12 C08L47/00

    摘要: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 μm to 6,500 μm. A shaped polymeric article comprising the polymeric substrate is also disclosed.

    THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

    公开(公告)号:US20230045848A1

    公开(公告)日:2023-02-16

    申请号:US17789005

    申请日:2020-03-31

    IPC分类号: C08L47/00 C08J5/04 B32B15/20

    摘要: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

    WATER-BASED COATING COMPOSITION, AND MULTI-LAYER COATING FILM

    公开(公告)号:US20220411643A1

    公开(公告)日:2022-12-29

    申请号:US17899904

    申请日:2022-08-31

    摘要: A challenge of the present invention is to provide a water-based coating composition capable of providing a design superior in depth feeling in the formation of a multilayer coating film having a so-called color clear coating film. The present invention relates to a water-based coating composition comprising a coating film-forming resin (i) and a coloring pigment dispersion (ii), wherein the coating film-forming resin (i) comprises: an acrylic resin emulsion (A) having an average particle diameter of 100 nm or less in an amount of 10 to 60% by mass in terms of the resin solid content of the coating film-forming resin (i), a water-soluble acrylic resin (B) in an amount of 5 to 40% by mass in terms of the resin solid content of the coating film-forming resin (i), and a melamine resin (C) in an amount of 20 to 40% by mass in terms of the resin solid content of the coating film-forming resin (i); and the coloring pigment dispersion (ii) comprises a coloring pigment (D) having a 90%-volume particle diameter (D90) of 100 nm or less.