公开(公告)号：US20240326124A1

公开(公告)日：2024-10-03

申请号：US18580003

申请日：2022-07-12

Applicant: TAIYO NIPPON SANSO CORPORATION

Inventor： Katsunori TAKADA ,  Naoya YAMAWAKI ,  Hiroshi IGARASHI ,  Noboru SUZUKI

IPC: B22F1/0545 ,  B22F1/102 ,  B22F9/20

CPC classification number: B22F1/0545 ,  B22F1/102 ,  B22F9/20 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2302/45 ,  B22F2304/054

Abstract: The present invention provides composite copper nanoparticles that have high dispersibility in organic solvents, have little thermal shrinkage even when sintered at 300° C. or higher, and can form smooth electrode films. The present invention provides composite copper nanoparticles in which the surface of the copper nanoparticles is modified with a silane coupling agent, wherein the copper nanoparticles have a film containing cuprous oxide and copper carbonate on at least a part of the surface, wherein when the entire composite copper nanoparticles are taken as 100% by mass, a mass carbon concentration is 0.5 to 1.5% by mass, wherein a mass carbon concentration caused by the silane coupling agent in the mass carbon concentration is 0.5 to 1.2% by mass, and wherein when a total mass of the composite copper nanoparticles is 100% by mass, a mass silicon concentration is in a range from 0.05 to 0.11% by mas