LAMINATED ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20220319777A1

    公开(公告)日:2022-10-06

    申请号:US17700608

    申请日:2022-03-22

    Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

    LAMINATED ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20220319767A1

    公开(公告)日:2022-10-06

    申请号:US17708690

    申请日:2022-03-30

    Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface, and a bottom surface electrode formed on the bottom surface of the element body, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, the first electrode layer is a resin electrode laminated to cover the second electrode layer, and has a stretched portion configured to extend to the side surface, and a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface.

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