公开(公告)号：US20180197649A1

公开(公告)日：2018-07-12

申请号：US15577161

申请日：2016-12-08

Applicant: TDK CORPORATION

Inventor： Hiroshi SHINGAI ,  Yoshihisa TAMAGAWA ,  Yoshihiko TANABE ,  Motohiro SAKURAI ,  Yoshinori SATO

IPC: H01B1/02 ,  H01B5/14 ,  H01B3/10 ,  C23C14/08

Abstract: The transparent conductor includes a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer in the order presented. The first metal oxide layer contains zinc oxide, indium oxide, and titanium oxide, and the content of SnO2 in the first metal oxide layer is 40 mol % or less with respect to the total of four components of zinc oxide, indium oxide, titanium oxide, and tin oxide in terms of ZnO, In2O3, TiO2, and SnO2, respectively. The second metal oxide layer contains the four components, and the content of SnO2 in the second metal oxide layer is 12 to 40 mol % with respect to the total of the four components in terms of ZnO, In2O3, TiO2, and SnO2, respectively.

公开(公告)号：US20220319777A1

公开(公告)日：2022-10-06

申请号：US17700608

申请日：2022-03-22

Applicant: TDK CORPORATION

Inventor： Noriyuki SAITO ,  Osamu HIROSE ,  Toru YOSHIDA ,  Yoshinori SATO ,  Akira SUDA ,  Akira NAKAMURA

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/03 ,  H05K1/05

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

公开(公告)号：US20180315545A1

公开(公告)日：2018-11-01

申请号：US15940301

申请日：2018-03-29

Applicant: TDK CORPORATION

Inventor： Shohei KUSUMOTO ,  Noriaki OOTSUKA ,  Minoru ABE ,  Yoshinori SATO

IPC: H01F27/36 ,  H01F27/40 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228

CPC classification number: H01F27/36 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/292 ,  H01F27/362 ,  H01F27/40 ,  H01F2017/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H03H1/00

Abstract: A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

公开(公告)号：US20240389201A1

公开(公告)日：2024-11-21

申请号：US18288243

申请日：2022-04-25

Applicant: TDK CORPORATION

Inventor： Shouhei HARADA ,  Koji MISHIMA ,  Yoshinori SATO ,  Kazushi YAMADA ,  Hideaki ITOU

IPC: H05B3/84 ,  B60S1/02 ,  E06B7/12

Abstract: A film heater includes a transparent substrate and a transparent heating element, wherein a surface of the transparent substrate opposite to the transparent heating element has a water contact angle of 55° or less or 90° or more. A heater-equipped glass includes the film heater, a glass plate opposite to the surface, and an electrode in contact with the transparent heating element of the film heater, the electrode being disposed between the film heater and the glass plate.

公开(公告)号：US20220319767A1

公开(公告)日：2022-10-06

申请号：US17708690

申请日：2022-03-30

Applicant: TDK CORPORATION

Inventor： Noriyuki SAITO ,  Yoshinori SATO ,  Toru YOSHIDA ,  Akira SUDA ,  Akira NAKAMURA

IPC: H01F27/29 ,  H01F17/00

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface, and a bottom surface electrode formed on the bottom surface of the element body, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, the first electrode layer is a resin electrode laminated to cover the second electrode layer, and has a stretched portion configured to extend to the side surface, and a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface.

公开(公告)号：US20190199310A1

公开(公告)日：2019-06-27

申请号：US16227355

申请日：2018-12-20

Applicant: TDK CORPORATION

Inventor： Yoshinori SATO ,  Shigeyuki DOI ,  Takeo OUGIMOTO

IPC: H03H1/00 ,  H01G4/232 ,  H03H7/01 ,  H01G4/30 ,  H01F17/00 ,  H01G4/008 ,  H01G4/40 ,  H01G4/38 ,  H01F41/04

CPC classification number: H03H1/00 ,  H01F17/0013 ,  H01F41/043 ,  H01F2017/0026 ,  H01F2017/008 ,  H01G4/0085 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085

Abstract: A method of manufacturing an electronic component includes: preparing an element body configured to have a rectangular parallelepiped shape and include a first surface serving as a mounting surface, a second surface opposing the first surface, and a third surface extending in such a way as to connect the first surface and the second surface; forming a chamfered portion chamfered between the first surface and the third surface; forming a terminal electrode on the first surface; covering the chamfered portion and the first surface with a covering member; forming a metal shield film on a part of the element body, the part including at least the second surface and the third surface and exposed from the covering member; and removing the covering member.

公开(公告)号：US20190160783A1

公开(公告)日：2019-05-30

申请号：US16309295

申请日：2017-06-09

Applicant: TDK CORPORATION

Inventor： Hiroshi SHINGAI ,  Yoshihisa TAMAGAWA ,  Yoshihiko TANABE ,  Yoshinori SATO

IPC: B32B9/04 ,  B32B15/08 ,  C01G19/02 ,  C01G33/00 ,  H01B5/14 ,  H01L51/50 ,  H05B33/04 ,  H05B33/28

Abstract: A transparent conductor includes: a transparent resin base material; a first metal oxide layer; a metal layer including a silver alloy; and a second metal oxide layer, in this order. The first metal oxide layer contains at least one of tin oxide and niobium oxide. When the tin oxide and the niobium oxide are respectively set in terms of SnO2 and Nb2O5, a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the first metal oxide layer is greater than a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the second metal oxide layer, and the content in the first metal oxide layer is greater than or equal to 45 mol %.