公开(公告)号：US20240210212A1

公开(公告)日：2024-06-27

申请号：US18479999

申请日：2023-10-03

Applicant: TDK CORPORATION

Inventor： Yohei HIROTA ,  Shuhei MIYAZAKI ,  Fumiya SADO

IPC: G01D5/16 ,  G01L1/22

CPC classification number: G01D5/16 ,  G01L1/22

Abstract: A sensor device includes a support, a sensor chip, and an electrically-conductive pillar. The support has a first surface. The sensor chip is provided on the first surface and includes a substrate and a sensor element circuitry. The substrate has a second surface. The sensor element circuitry is provided on the second surface. The electrically-conductive pillar is provided on the first surface. The electrically-conductive pillar has a pillar height from the first surface to an upper end of the electrically-conductive pillar. The sensor chip has a chip height from the first surface to the second surface. The pillar height is greater than the chip height. The electrically-conductive pillar includes a structure in which a first tier part having a first cross-sectional area and a second tier part having a second cross-sectional area smaller than the first cross-sectional area are stacked in order from the first surface.