公开(公告)号：US12300423B2

公开(公告)日：2025-05-13

申请号：US17701448

申请日：2022-03-22

Applicant: TDK CORPORATION

Inventor： Akihiko Oide ,  Makoto Yoshino ,  Tomoki Okada ,  Hideki Saitou ,  Seiji Osada ,  Kazuhiro Ebina ,  Kunio Oda ,  Takashi Abe ,  Akio Shibata ,  Kazuo Iwai

IPC: H01F27/29 ,  H01F17/00

Abstract: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.