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公开(公告)号：US20230117965A1
公开(公告)日：2023-04-20
申请号：US17964972
申请日：2022-10-13
Applicant: TDK CORPORATION
Inventor： Makoto ONO , Nobuo KITAJIMA
Abstract: Provided is a solder composition containing Sn. The composition comprises: 1.0% by mass or more and 5.0% by mass or less of Cu; 0.1% by mass or more and 0.5% by mass or less of Ni; and more than 0.01% by mass and 0.5% by mass or less of Ge.
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