公开(公告)号：US20230307167A1

公开(公告)日：2023-09-28

申请号：US18166347

申请日：2023-02-08

Applicant: TDK CORPORATION

Inventor： Munehiro TAKAKU ,  Nobuyuki Okuzawa ,  Kazuya Tobita ,  Teruhiro Mitsuyasu

IPC: H01F17/00 ,  H01F27/29

CPC classification number: H01F17/0013 ,  H01F27/292 ,  H01F2027/2809

Abstract: Provided is a multilayer coil component in which a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface is located closer to an end surface in a first direction than a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface, and a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface is located closer to an end surface in the first direction than a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface.