公开(公告)号：US09871500B2

公开(公告)日：2018-01-16

申请号：US15082513

申请日：2016-03-28

Applicant: TDK CORPORATION

Inventor： Masanori Tsutsumi ,  Kazuhiro Tsukamoto ,  Manabu Kitami ,  Toshiyuki Takami ,  Shohei Kusumoto ,  Noriyuki Hirabayashi

IPC: H03H7/42 ,  H01P5/10

CPC classification number: H03H7/42

Abstract: A multilayer electronic component includes a stack and a balun. The stack includes a plurality of stacked dielectric layers and conductor layers. The balun is formed using the stack. The balun includes an unbalanced transmission line and first to fourth balanced transmission lines. The unbalanced transmission line includes a first line portion and a second line portion connected in series. The first and second balanced transmission lines are configured to be electromagnetically coupled to the first line portion. The third and fourth balanced transmission lines are configured to be electromagnetically coupled to the second line portion.