公开(公告)号：US09871500B2

公开(公告)日：2018-01-16

申请号：US15082513

申请日：2016-03-28

Applicant: TDK CORPORATION

Inventor： Masanori Tsutsumi ,  Kazuhiro Tsukamoto ,  Manabu Kitami ,  Toshiyuki Takami ,  Shohei Kusumoto ,  Noriyuki Hirabayashi

IPC: H03H7/42 ,  H01P5/10

CPC classification number: H03H7/42

Abstract: A multilayer electronic component includes a stack and a balun. The stack includes a plurality of stacked dielectric layers and conductor layers. The balun is formed using the stack. The balun includes an unbalanced transmission line and first to fourth balanced transmission lines. The unbalanced transmission line includes a first line portion and a second line portion connected in series. The first and second balanced transmission lines are configured to be electromagnetically coupled to the first line portion. The third and fourth balanced transmission lines are configured to be electromagnetically coupled to the second line portion.

公开(公告)号：US11011304B2

公开(公告)日：2021-05-18

申请号：US16943419

申请日：2020-07-30

Applicant: TDK CORPORATION

Inventor： Shohei Kusumoto ,  Noriaki Ootsuka ,  Minoru Abe ,  Yoshinori Sato

IPC: H01F27/36 ,  H01F27/40 ,  H01G4/228 ,  H01G4/30 ,  H01F27/28 ,  H01F27/29 ,  H01F17/00 ,  H03H1/00 ,  H01G4/38 ,  H01G4/232 ,  H01G4/40

Abstract: A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

公开(公告)号：US10796844B2

公开(公告)日：2020-10-06

申请号：US15940301

申请日：2018-03-29

Applicant: TDK CORPORATION

Inventor： Shohei Kusumoto ,  Noriaki Ootsuka ,  Minoru Abe ,  Yoshinori Sato

IPC: H01F27/36 ,  H01F27/40 ,  H01G4/228 ,  H01G4/30 ,  H01F27/28 ,  H01F27/29 ,  H01F17/00 ,  H03H1/00 ,  H01G4/38 ,  H01G4/232 ,  H01G4/40

Abstract: A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.