公开(公告)号：US20230253141A1

公开(公告)日：2023-08-10

申请号：US18163500

申请日：2023-02-02

Applicant: TDK Corporation

Inventor： Takeshi OKUMURA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Hiroshi SAGAWA ,  Kenichi ICHINOSE ,  Taichi HIROSE ,  Hiromu SAKAMOTO

IPC: H01F27/28 ,  H01F27/29 ,  H03H7/01

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H03H7/0153 ,  H01F2027/2809

Abstract: Disclosed herein is a common mode filter that includes: a first conductor layer including a first coil pattern, a first connection pattern, and a first lead-out pattern connecting the first coil pattern and the first connection pattern; and a second conductor layer including a second coil pattern, a second connection pattern, and a second lead-out pattern connecting the second coil pattern and the second connection pattern. The extending direction of the first section of the first lead-out pattern and an extending direction of the second section of the second lead-out pattern are opposed to each other. The first section is longer than the second section. The second coil pattern is larger in diameter than the first coil pattern.

公开(公告)号：US20220102045A1

公开(公告)日：2022-03-31

申请号：US17486281

申请日：2021-09-27

Applicant: TDK Corporation

Inventor： Takeshi OKUMURA ,  Tomonaga NISHIKAWA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Yosuke MIZUTANI ,  Hiroshi SAGAWA ,  Kenji TANAKA

IPC: H01F17/00 ,  H01F27/29

Abstract: Disclosed herein is a coil component that includes a first conductor layer having first and third planar spiral coils and second conductor layer having second planar spiral coil. The first planar spiral coil is positioned on an outer peripheral side of the third planar spiral coil. The first planar spiral coil has a pattern width larger than that of the third planar spiral coil. The second planar spiral coil is offset to the third planar spiral coil side in a plan view.