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公开(公告)号：US20240412917A1
公开(公告)日：2024-12-12
申请号：US18696745
申请日：2022-06-27
Applicant: TDK Corporation
Inventor： Takeshi YOKOYAMA , Toshiyuki ABE , Yuki HASHIMOTO , Takeshi OKUMURA , Tomonaga NISHIKAWA
Abstract: To prevent the occurrence of a short-circuit failure through a magnetic body layer. A coil component includes interlayer insulating films and conductor layers which are alternately stacked on a magnetic body layer. The conductor layers respectively have coil patterns, terminal patterns which are provided at positions overlapping a terminal electrode, and terminal patterns which are provided at positions overlapping a terminal electrode. The terminal patterns are connected to the terminal electrode, and the terminal patterns are connected to the terminal electrode. The terminal pattern is insulated from the terminal electrode. This can prevent a short circuit failure between a coil pattern or terminal pattern and the terminal pattern through the magnetic body layer.
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公开(公告)号：US20240395452A1
公开(公告)日：2024-11-28
申请号：US18695782
申请日：2022-06-27
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Tomonaga NISHIKAWA , Masanori SUZUKI
Abstract: To provide a stacked coupling coil component capable of achieving a desired coupling coefficient while suppressing the height of the component. A stacked coupling coil component 1 has conductor layers L1, L3, and L5 respectively including spiral coils 11 to 13, conductor layers L2, L4, and L6 respectively including spiral coils 21 to 23, and a conductor layer L7 including spiral coils 31 and 41 which are disposed at mutually different planar positions. The spiral coils 11 to 13 and 21 to 23 overlap one another. The spiral coils 11 to 13 and 31 are connected in series between terminal electrodes E1 and E2, the spiral coils 21 to 23 and 41 are connected in series between terminal electrodes E4 and E3. This allows adjustment of a coupling coefficient, making it possible to achieve a desired coupling coefficient while suppressing the height of the component.
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公开(公告)号：US20230245813A1
公开(公告)日：2023-08-03
申请号：US18160446
申请日：2023-01-27
Applicant: TDK Corporation
Inventor： Takeshi OKUMURA , Kouji KAWAMURA , Hidenori TSUTSUI , Yosuke MIZUTANI , Hiroyuki NISHIOKA
CPC classification number: H01F27/2804 , H01F27/29 , H01F27/06 , H01F41/041 , H01F2027/2809
Abstract: Disclosed herein is a coil component that includes conductor layers embedded in a base and terminal electrodes embedded in the base. Each of the terminal electrodes is exposed to a mounting surface of the base and a respective corner portion of the base. The conductor layers include connection patterns each connected to an associated one of the terminal electrodes. The first connection pattern is exposed to the third side surface without being exposed to the first side surface, the second connection pattern is exposed to the fourth side surface without being exposed to the first side surface, the third connection pattern is exposed to the third side surface without being exposed to the second side surface, and the fourth connection pattern is exposed to the fourth side surface without being exposed to the second side surface.
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公开(公告)号：US20230326667A1
公开(公告)日：2023-10-12
申请号：US18183516
申请日：2023-03-14
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Masanori SUZUKI
CPC classification number: H01F27/292 , H01F27/24 , H01F27/323
Abstract: Disclosed herein is a coil component that includes: a coil part including a coil conductor embedded in the magnetic element body and a bump electrode embedded in the magnetic element body through a second insulating resin layer and connected to an end portion of a coil conductor. A side surface of the bump electrode at a mounting surface is covered with the second insulating resin layer. The second insulating resin layer covering the side surface of the bump electrode has a first area having a first width in a planar direction parallel with the mounting surface and a second area having a second width in the planar direction larger than the first width.
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公开(公告)号：US20220102043A1
公开(公告)日：2022-03-31
申请号：US17486196
申请日：2021-09-27
Applicant: TDK Corporation
Inventor： Hidenori TSUTSUI , Kouji KAWAMURA , Hiromu SAKAMOTO , Kengo OSADA , Takuro TSURUTA , Takeshi OKUMURA
Abstract: Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.
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Patent Agency Ranking
公开(公告)号：US20130314189A1
公开(公告)日：2013-11-28
申请号：US13887118
申请日：2013-05-03
Applicant: TDK CORPORATION
Inventor： Takeshi OKUMURA , Tomokazu ITO
IPC: H01F5/00
CPC classification number: H01F5/003 , H01F17/0013 , H01F17/04 , H01F27/292
Abstract: Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes.
Abstract translation: 本文公开了一种线圈部件，其包括形成在基板上的绝缘层，设置在基板和绝缘层之间的线圈导体，连接到线圈导体的一端的第一电极，连接到线圈导体的另一端的第二电极 线圈导体和形成在绝缘层上的磁性层，以便覆盖每个第一和第二电极的侧表面，而不覆盖每个第一和第二电极的顶表面。
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公开(公告)号：US20240242872A1
公开(公告)日：2024-07-18
申请号：US18409624
申请日：2024-01-10
Applicant: TDK Corporation
Inventor： Takeshi OKUMURA , Kouji KAWAMURA , Hidenori TSUTSUI , Hibiki MIYASAKA , Yosuke MIZUTANI
CPC classification number: H01F27/2804 , H01F27/292 , H05K1/181 , H01F2027/2809 , H05K2201/1003
Abstract: Disclosed herein is a coil component that includes an element body having a mounting surface, a coil pattern embedded in the element body and having a coil axis extending perpendicular to the mounting surface, and a terminal electrode connected to the coil pattern and exposed to the mounting surface. The terminal electrode has a cutout part so as to avoid overlapping with the coil pattern in a plan view along the coil axis.
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公开(公告)号：US20240087787A1
公开(公告)日：2024-03-14
申请号：US18463649
申请日：2023-09-08
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Tomonaga NISHIKAWA , Naoaki FUJII , Kazuhiro YOSHIKAWA
CPC classification number: H01F17/0013 , H01F17/04 , H01F27/022 , H01F27/292
Abstract: Disclosed herein is a coil component that includes a coil part embedded in a magnetic element body. The coil part has a structure in which plural interlayer insulating films and plural conductor layers having a coil pattern are alternately stacked. At least one of the conductor layers has a clearance area having no coil pattern and extending radially outward from a center axis of the coil part. The magnetic element body includes a first magnetic resin layer provided in an inner diameter area of the coil part, a second magnetic resin layer provided in a radially outside area of the coil part, and a fifth magnetic resin layer filled in the clearance area and contacting the first and second magnetic resin layers.
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公开(公告)号：US20230253141A1
公开(公告)日：2023-08-10
申请号：US18163500
申请日：2023-02-02
Applicant: TDK Corporation
Inventor： Takeshi OKUMURA , Kouji KAWAMURA , Hidenori TSUTSUI , Hiroshi SAGAWA , Kenichi ICHINOSE , Taichi HIROSE , Hiromu SAKAMOTO
CPC classification number: H01F27/2804 , H01F27/292 , H03H7/0153 , H01F2027/2809
Abstract: Disclosed herein is a common mode filter that includes: a first conductor layer including a first coil pattern, a first connection pattern, and a first lead-out pattern connecting the first coil pattern and the first connection pattern; and a second conductor layer including a second coil pattern, a second connection pattern, and a second lead-out pattern connecting the second coil pattern and the second connection pattern. The extending direction of the first section of the first lead-out pattern and an extending direction of the second section of the second lead-out pattern are opposed to each other. The first section is longer than the second section. The second coil pattern is larger in diameter than the first coil pattern.
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公开(公告)号：US20220102045A1
公开(公告)日：2022-03-31
申请号：US17486281
申请日：2021-09-27
Applicant: TDK Corporation
Inventor： Takeshi OKUMURA , Tomonaga NISHIKAWA , Kouji KAWAMURA , Hidenori TSUTSUI , Yosuke MIZUTANI , Hiroshi SAGAWA , Kenji TANAKA
Abstract: Disclosed herein is a coil component that includes a first conductor layer having first and third planar spiral coils and second conductor layer having second planar spiral coil. The first planar spiral coil is positioned on an outer peripheral side of the third planar spiral coil. The first planar spiral coil has a pattern width larger than that of the third planar spiral coil. The second planar spiral coil is offset to the third planar spiral coil side in a plan view.
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