公开(公告)号：US20240196538A1

公开(公告)日：2024-06-13

申请号：US18522664

申请日：2023-11-29

Applicant: TDK Corporation

Inventor： Akihiro MASUDA ,  Katsuya MIURA ,  Natsuki KUMAGAI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/0203 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.