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公开(公告)号：US20250063818A1
公开(公告)日：2025-02-20
申请号：US18801851
申请日：2024-08-13
Applicant: TDK Corporation
Inventor： Hiroshi SHINGAI , Daisuke SONODA , Toshiaki KASAI , Tomoyuki GOI , Yasumasa HARIHARA
IPC: H01L27/12
Abstract: A wiring body includes a first resin layer having a first main surface and a second main surface and having a through hole passing from the first main surface to the second main surface, an electroconductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the electroconductive layer from the first main surface side.
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