公开(公告)号：US20250063818A1

公开(公告)日：2025-02-20

申请号：US18801851

申请日：2024-08-13

Applicant: TDK Corporation

Inventor： Hiroshi SHINGAI ,  Daisuke SONODA ,  Toshiaki KASAI ,  Tomoyuki GOI ,  Yasumasa HARIHARA

IPC: H01L27/12

Abstract: A wiring body includes a first resin layer having a first main surface and a second main surface and having a through hole passing from the first main surface to the second main surface, an electroconductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the electroconductive layer from the first main surface side.

公开(公告)号：US20240349425A1

公开(公告)日：2024-10-17

申请号：US18683879

申请日：2022-08-17

Applicant: TDK CORPORATION

Inventor： Yoshihisa TAMAGAWA ,  Hiroshi SHINGAI ,  Daisuke SONODA ,  Keisuke NISHIOKA ,  Ken NODA

IPC: H05K1/09 ,  G02F1/1345 ,  H05K3/10

CPC classification number: H05K1/095 ,  H05K3/107 ,  G02F1/1345 ,  H05K2201/10136 ,  H05K2203/10

Abstract: An electrically conductive film including a film-like base material, and a resin layer and an electrically conductive part provided on a main surface of the base material is disclosed. The resin layer has a pattern including a linear trench. The electrically conductive part has a portion provided in the linear trench. The resin layer has raised portions formed along the trench on both sides of the linear trench and raised in the thickness direction of the resin layer.