ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20250111969A1

    公开(公告)日:2025-04-03

    申请号:US18892837

    申请日:2024-09-23

    Abstract: A coil component includes an element body formed by laminating a plurality of insulator layers, and a pillar part disposed in the element body and extending in a lamination direction of the plurality of insulator layers. The pillar part has a plurality of pillar members laminated in the lamination direction. Between the two pillar members in the lamination direction, a defining part that defines a contact surface between the two pillar members is provided. The defining part is formed of a material different from a material of the pillar part, and is disposed at edges of the two pillar members when viewed from the lamination direction.

    ELECTRONIC COMPONENT
    2.
    发明公开

    公开(公告)号:US20240312696A1

    公开(公告)日:2024-09-19

    申请号:US18429997

    申请日:2024-02-01

    CPC classification number: H01F27/292 H01F27/2804 H01F2027/2809

    Abstract: An electronic component includes: an element body having a main surface as a mounting surface; a coil portion having a coil pattern formed by a plurality of coil conductors in the element body; and a pair of external electrodes formed on the main surface of the element body and electrically connected to the coil portion, the external electrode includes a first electrode layer exposed from the main surface of the element body and a second electrode layer embedded in the element body, the first electrode layer includes a first region overlapping the second electrode layer and a second region not overlapping the second electrode layer when viewed from a first direction perpendicular to the main surface, the second region overlaps the coil conductor when viewed from the first direction, and the second electrode layer has an extended portion protruding from an outer edge of the first electrode layer.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240312695A1

    公开(公告)日:2024-09-19

    申请号:US18429973

    申请日:2024-02-01

    CPC classification number: H01F27/292 H01F17/0013

    Abstract: An electronic component includes: an element body having a main surface as a mounting surface; and a pair of external electrodes including an electrode layer embedded inside an opening of the element body and a plating layer formed on the electrode layer, in a first direction perpendicular to the main surface, a main surface of the electrode layer is disposed deeper inside the element body than a virtual plane obtained by virtually extending the main surface in the opening, and the plating layer is formed on the main surface of the electrode layer and covers the electrode layer so as to extend from the virtual plane to a main surface of the element body.

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