公开(公告)号：US20220293490A1

公开(公告)日：2022-09-15

申请号：US17635474

申请日：2020-07-28

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Markus Puff ,  Jan lnle ,  Nele Reimer

IPC: H01L23/473

Abstract: A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.