公开(公告)号：US20210066199A1

公开(公告)日：2021-03-04

申请号：US16961078

申请日：2019-01-30

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Johann Pichler ,  Nele Reimer ,  Markus Koini ,  Manfred Schweinzger

IPC: H01L23/532 ,  H01L23/15 ,  H01L23/36

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

公开(公告)号：US20220024188A1

公开(公告)日：2022-01-27

申请号：US17312701

申请日：2019-12-05

Applicant: TDK Electronics AG

Inventor： Nele Reimer ,  Manfred Schweinzger

IPC: B32B18/00 ,  C04B37/00

Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

公开(公告)号：US11958271B2

公开(公告)日：2024-04-16

申请号：US17312701

申请日：2019-12-05

Applicant: TDK Electronics AG

Inventor： Nele Reimer ,  Manfred Schweinzger

IPC: B32B18/00 ,  C04B37/00

CPC classification number: B32B18/00 ,  C04B37/001 ,  C04B2237/343 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368

Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

公开(公告)号：US20220293490A1

公开(公告)日：2022-09-15

申请号：US17635474

申请日：2020-07-28

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Markus Puff ,  Jan lnle ,  Nele Reimer

IPC: H01L23/473

Abstract: A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.

公开(公告)号：US20240157683A1

公开(公告)日：2024-05-16

申请号：US18421673

申请日：2024-01-24

Applicant: TDK Electronics AG

Inventor： Nele Reimer ,  Manfred Schweinzger

IPC: B32B18/00 ,  C04B37/00

CPC classification number: B32B18/00 ,  C04B37/001 ,  C04B2237/343 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368

Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

公开(公告)号：US11462476B2

公开(公告)日：2022-10-04

申请号：US16961078

申请日：2019-01-30

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Johann Pichler ,  Nele Reimer ,  Markus Koini ,  Manfred Schweinzger

IPC: H01L23/532 ,  H01L23/15 ,  H01L23/36

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.