公开(公告)号：US11387045B2

公开(公告)日：2022-07-12

申请号：US16976026

申请日：2019-02-15

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Thomas Wippel ,  Franz Rinner

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.