公开(公告)号：US20240344897A1

公开(公告)日：2024-10-17

申请号：US18579477

申请日：2022-07-04

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Elisabeth Schwarz-Funder ,  Wolfgang Fail ,  Gerhard Hojas ,  Subramanian Ravichandran ,  Dhananjay Chavan

IPC: G01K7/22

CPC classification number: G01K7/22

Abstract: In an embodiment a NTC sensor include a chip, two parallel wires, each wire having contact points, and contact-connections between the chip and the contact points of each of the wires, wherein a maximum lateral dimension of the NTC sensor in any direction perpendicular to a direction of extension of the wires is equal to or less than a sum of the lateral dimensions of the chip and the wires.

公开(公告)号：US20250003810A1

公开(公告)日：2025-01-02

申请号：US18576343

申请日：2022-05-30

Applicant: TDK Electronics AG

Inventor： Gerhard Hojas ,  Subramanian Ravichandran ,  Dhananjay Chavan ,  Wolfgang Fail

IPC: G01K7/22 ,  H01C1/14 ,  H01C17/00

Abstract: In an embodiment a method for assembling NTC sensor includes providing an NTC thermistor element and connection wires having terminals for contacting the NTC thermistor element; and self-heating the NTC thermistor element while applying an electrical current during the following steps: dispensing solder paste to the terminals of the connection wires, applying the connection wires to the NTC thermistor element and melting the solder paste by a generated heat of the NTC thermistor element thereby forming solder bonds between the NTC thermistor element and the connection wires.