公开(公告)号：US20250065355A1

公开(公告)日：2025-02-27

申请号：US18949524

申请日：2024-11-15

Applicant: TDK Electronics AG

Inventor： Subramanian Ravichandran ,  Gerhard Hojas

IPC: B05C5/00 ,  B05C11/10 ,  G01K7/22

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

公开(公告)号：US12172184B2

公开(公告)日：2024-12-24

申请号：US18029765

申请日：2022-08-02

Applicant: TDK Electronics AG

Inventor： Subramanian Ravichandran ,  Gerhard Hojas

IPC: B05C5/00 ,  B05C11/10 ,  G01K7/22

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

公开(公告)号：US20240344897A1

公开(公告)日：2024-10-17

申请号：US18579477

申请日：2022-07-04

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Elisabeth Schwarz-Funder ,  Wolfgang Fail ,  Gerhard Hojas ,  Subramanian Ravichandran ,  Dhananjay Chavan

IPC: G01K7/22

CPC classification number: G01K7/22

Abstract: In an embodiment a NTC sensor include a chip, two parallel wires, each wire having contact points, and contact-connections between the chip and the contact points of each of the wires, wherein a maximum lateral dimension of the NTC sensor in any direction perpendicular to a direction of extension of the wires is equal to or less than a sum of the lateral dimensions of the chip and the wires.

公开(公告)号：US20250003810A1

公开(公告)日：2025-01-02

申请号：US18576343

申请日：2022-05-30

Applicant: TDK Electronics AG

Inventor： Gerhard Hojas ,  Subramanian Ravichandran ,  Dhananjay Chavan ,  Wolfgang Fail

IPC: G01K7/22 ,  H01C1/14 ,  H01C17/00

Abstract: In an embodiment a method for assembling NTC sensor includes providing an NTC thermistor element and connection wires having terminals for contacting the NTC thermistor element; and self-heating the NTC thermistor element while applying an electrical current during the following steps: dispensing solder paste to the terminals of the connection wires, applying the connection wires to the NTC thermistor element and melting the solder paste by a generated heat of the NTC thermistor element thereby forming solder bonds between the NTC thermistor element and the connection wires.

公开(公告)号：US20240001395A1

公开(公告)日：2024-01-04

申请号：US18029765

申请日：2022-08-02

Applicant: TDK Electronics AG

Inventor： Subramanian Ravichandran ,  Gerhard Hojas

IPC: B05C5/00 ,  B05C11/10

CPC classification number: B05C5/002 ,  B05C11/10 ,  G01K7/22

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.