公开(公告)号：US20210274673A1

公开(公告)日：2021-09-02

申请号：US17168413

申请日：2021-02-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H05K7/10 ,  H01R12/71 ,  H01R12/70

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

公开(公告)号：US11443998B2

公开(公告)日：2022-09-13

申请号：US16869888

申请日：2020-05-08

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H01L23/32 ,  G02B6/42 ,  H01L23/367 ,  H01R12/70 ,  H01R12/85

Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.

公开(公告)号：US11477904B2

公开(公告)日：2022-10-18

申请号：US17168413

申请日：2021-02-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H05K7/10 ,  H01R12/71 ,  H01R12/70

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.