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公开(公告)号:US20190148862A1
公开(公告)日:2019-05-16
申请号:US15810744
申请日:2017-11-13
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Justin Dennis Pickel , John Joseph Consoli , Chad William Morgan , Timothy Robert Minnick , David Patrick Orris , Daniel Briner Shreffler , David Allison Trout , Arturo Pachon Munoz
IPC: H01R13/03 , H01R13/646 , H01R12/71
CPC classification number: H01R13/03 , H01R12/716 , H01R13/646 , H01R13/6587
Abstract: An electrical connector includes a housing and a plurality of conductors held within the housing. The conductors are configured to electrically connect to mating conductors of a mating connector. The conductors each extend a length between a mating end and a mounting end of the respective conductor. One or more of the conductors include a copper alloy core, a copper plating layer, and a protective outer layer. The copper plating layer surrounds the copper alloy core, and is composed of a different material than the copper alloy core. The protective outer layer is disposed on and surrounds the copper plating layer. The protective outer layer is composed of a non-conductive polymeric material.
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公开(公告)号:US10811801B2
公开(公告)日:2020-10-20
申请号:US15810744
申请日:2017-11-13
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Justin Dennis Pickel , John Joseph Consoli , Chad William Morgan , Timothy Robert Minnick , David Patrick Orris , Daniel Briner Shreffler , David Allison Trout , Arturo Pachon Munoz
IPC: H01R13/03 , H01R12/71 , H01R13/646 , H01R13/6587
Abstract: An electrical connector includes a housing and a plurality of conductors held within the housing. The conductors are configured to electrically connect to mating conductors of a mating connector. The conductors each extend a length between a mating end and a mounting end of the respective conductor. One or more of the conductors include a copper alloy core, a copper plating layer, and a protective outer layer. The copper plating layer surrounds the copper alloy core, and is composed of a different material than the copper alloy core. The protective outer layer is disposed on and surrounds the copper plating layer. The protective outer layer is composed of a non-conductive polymeric material.
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