公开(公告)号：US20190103691A1

公开(公告)日：2019-04-04

申请号：US15945767

申请日：2018-04-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Matthew Jeffrey Sypolt ,  Chad William Morgan ,  John Joseph Consoli ,  Margaret Mahoney Fernandes

IPC: H01R12/73 ,  H01R13/6585 ,  H01R13/6582 ,  H01R13/11 ,  H01R12/70 ,  H01R13/631 ,  H05K1/14 ,  H05K7/14

Abstract: A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.

公开(公告)号：US11018456B2

公开(公告)日：2021-05-25

申请号：US16522760

申请日：2019-07-26

Applicant: TE CONNECTIVITY CORPORATION ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： David Allison Trout ,  Douglas Edward Shirk ,  Justin Dennis Pickel ,  Timothy Robert Minnick ,  Margaret Mahoney Fernandes ,  Tetsuya Katano ,  Masayuki Aizawa

IPC: H01R13/6586 ,  H01R13/6461 ,  H01R13/514 ,  H01R107/00 ,  H01R13/6587 ,  H01R12/73 ,  H01R9/24 ,  H01R12/72 ,  H01R13/658 ,  H01R13/6473 ,  H01R13/6585 ,  H01R13/6581

Abstract: A contact module includes a leadframe having signal contacts arranged in pairs. Each signal contact includes a lead having sides extending between inner and outer edges. The contact module includes a dielectric frame supporting the leadframe having a first side and a second side with windows extending through the dielectric frame between the first side and the second side. The windows exposing to air the sides, the inner edges and the outer edges of the corresponding leads along a majority of lengths of the leads. The contact module includes a shield structure having a first ground shield at the first side and a second ground shield at the second side to provide electrical shielding for the signal contacts.

公开(公告)号：US20210028582A1

公开(公告)日：2021-01-28

申请号：US16522760

申请日：2019-07-26

Applicant: TE CONNECTIVITY CORPORATION ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： David Allison Trout ,  Douglas Edward Shirk ,  Justin Dennis Pickel ,  Timothy Robert Minnick ,  Margaret Mahoney Fernandes ,  Tetsuya Katano ,  Masayuki Aizawa

IPC: H01R13/6586 ,  H01R13/6599 ,  H01R13/514 ,  H01R13/6461

Abstract: A contact module includes a leadframe having signal contacts arranged in pairs. Each signal contact includes a lead having sides extending between inner and outer edges. The contact module includes a dielectric frame supporting the leadframe having a first side and a second side with windows extending through the dielectric frame between the first side and the second side. The windows exposing to air the sides, the inner edges and the outer edges of the corresponding leads along a majority of lengths of the leads. The contact module includes a shield structure having a first ground shield at the first side and a second ground shield at the second side to provide electrical shielding for the signal contacts.

公开(公告)号：US10522925B2

公开(公告)日：2019-12-31

申请号：US15945767

申请日：2018-04-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Matthew Jeffrey Sypolt ,  Chad William Morgan ,  John Joseph Consoli ,  Margaret Mahoney Fernandes

IPC: H01R13/6585 ,  H01R12/73 ,  H01R13/6582 ,  H01R13/11 ,  H01R12/70 ,  H05K1/14 ,  H05K7/14 ,  H01R13/631 ,  H01R12/82 ,  H01R13/658 ,  H01R13/6587 ,  H01R13/6594 ,  H01R12/52 ,  H01R13/6586 ,  H01R24/00

Abstract: A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.