公开(公告)号：US20220306884A1

公开(公告)日：2022-09-29

申请号：US17701814

申请日：2022-03-23

申请人： TE Connectivity Solutions GMBH

发明人： Lei WANG ,  Martin W. BAYES ,  Ting GAO ,  Kenneth SEUFER ,  Philip SINGER ,  James ZEIGLER

IPC分类号： C09D11/34 ,  C09D11/38 ,  C09D11/12 ,  C09D11/03 ,  B41M5/00

摘要： A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.