公开(公告)号：US20240030694A1

公开(公告)日：2024-01-25

申请号：US17870464

申请日：2022-07-21

申请人： TE Connectivity Solutions GmbH

发明人： Matthew Bryan Hitchcock ,  Nathan Philip Myer ,  Ram Kishore Venkatesan ,  Troy Agner ,  Subodh Patil ,  Barakissa Gakou ,  Andrew Jacob Vasbinder

IPC分类号： H02G15/013 ,  H01B17/30 ,  H02G15/007 ,  B60L53/16

CPC分类号： H02G15/013 ,  H01B17/30 ,  H02G15/007 ,  B60L53/16

摘要： A wire guide assembly includes a seal cover having a cover opening defined therethrough and a fixation element. A seal is fitted to the seal cover and defines a seal opening aligned with the cover opening in an axial direction of the assembly. A strain relief guide of the assembly is fitted to a side of the seal opposite the seal cover and defines a guide opening aligned with the seal opening and the cover opening in the axial direction.