公开(公告)号：US20190040282A1

公开(公告)日：2019-02-07

申请号：US16078492

申请日：2017-02-22

Applicant: TESA SE

Inventor： Marcel HÄHNEL ,  Sarah REICH

IPC: C09J5/02 ,  C09J7/20

Abstract: The invention relates to a method for bonding an adhesive layer (3) with a first joining part (4), in which a first surface (3a) of the adhesive layer (3) is applied to a first joining part surface (4a) and the first surface (3a) of the adhesive layer (3) and/or the first joining part surface (4a) is/are subjected to partial area pre-treatment, a separating force in pre-treated areas (6) between the first joining part surface (4a) and the first surface (3a) of the adhesive layer (3) is increased thereby, and on peeling of the adhesive layer (3) from the first joining part surface (4a), the adhesive layer (3) separates cohesively in pre-treated areas (6) and the first surface (3a) of the adhesive layer (3) separates adhesively from the first joining part surface (4a) is untreated areas (7).