公开(公告)号：US20210050180A1

公开(公告)日：2021-02-18

申请号：US17043042

申请日：2019-03-29

Applicant: Tescan Brno, s.r.o. ,  Tescan Orsay Holding, A.S.

Inventor： Andrey Denisyuk ,  Pavel Dolezel

IPC: H01J37/20 ,  H01J37/305 ,  H01J37/28

Abstract: A device for creating and placing a lamella comprises a focused ion beam, a scanning electron microscope, a stage for placing at least two specimens enabling tilting, rotation and movement of the specimen. The device further comprises a manipulator terminated by a needle for attaching and transporting the specimen. The manipulator is positioned in a plane perpendicular to the axis of the tilt of the specimen, thereby enabling easy transportation and placing of the lamella into the specimen holder for a transmission electron microscope, so-called grid. The manipulator is adjusted to rotate the needle about its own axis. Thus, it enables inverting of the lamella and its polishing over a layer of semiconductor substrate, on which a semiconductor structure is formed, in case of creating the lamella from a semiconductor device.

公开(公告)号：US10832918B2

公开(公告)日：2020-11-10

申请号：US16044715

申请日：2018-07-25

Applicant: TESCAN Brno, s.r.o. ,  TESCAN ORSAY HOLDING a.s.

Inventor： Andrey Denisyuk ,  Sharang Sharang ,  Jozef Vincenc Obona

IPC: C23F4/00 ,  H01L21/3065 ,  H01J37/305 ,  H01L21/263 ,  H01L21/66

Abstract: A method of uniformly removing material from a sample surface includes the steps of sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.

公开(公告)号：US20190074184A1

公开(公告)日：2019-03-07

申请号：US16044715

申请日：2018-07-25

Applicant: TESCAN Brno, s.r.o. ,  TESCAN ORSAY HOLDING a.s.

Inventor： Andrey Denisyuk ,  Sharang Sharang ,  Vincenc Jozef Obona

IPC: H01L21/3065 ,  H01L21/66 ,  H01L21/263 ,  C23F4/00

CPC classification number: H01L21/3065 ,  C23F4/00 ,  H01J37/3056 ,  H01J2237/3114 ,  H01J2237/31749 ,  H01L21/2633 ,  H01L22/12

Abstract: The subject matter of the invention is a method of uniformly removing material from a sample surface by sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.