公开(公告)号：US20200328156A1

公开(公告)日：2020-10-15

申请号：US16888245

申请日：2020-05-29

申请人： Tessera, Inc.

发明人： Benjamin D. Briggs ,  Elbert Huang ,  Raghuveer R. Patlolla ,  Cornelius Brown Peethala ,  David L. Rath ,  Chih-Chao Yang

IPC分类号： H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L21/768

摘要： A low aspect ratio interconnect is provided and includes a metallization layer, a liner and a metallic interconnect. The metallization layer includes bottommost and uppermost surfaces. The uppermost surface has a maximum post-deposition height from the bottommost surface at first metallization layer portions. The metallization layer defines a trench at second metallization layer portions. The liner includes is disposed to line the trench and includes liner sidewalls that have terminal edges that extend to the maximum post-deposition height and lie coplanar with the uppermost surface at the first metallization layer portions. The metallic interconnect is disposed on the liner to fill a trench remainder and has an uppermost interconnect surface that extends to the maximum post-deposition height and lies coplanar with the uppermost surface at the first metallization layer portions.

公开(公告)号：US10672707B2

公开(公告)日：2020-06-02

申请号：US16250351

申请日：2019-01-17

申请人： TESSERA, INC.

发明人： Benjamin D. Briggs ,  Elbert E. Huang ,  Raghuveer R. Patlolla ,  Cornelius Brown Peethala ,  David L. Rath ,  Chih-Chao Yang

IPC分类号： H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L21/768

摘要： A low aspect ratio interconnect is provided and includes a metallization layer, a liner and a metallic interconnect. The metallization layer includes bottommost and uppermost surfaces. The uppermost surface has a maximum post-deposition height from the bottommost surface at first metallization layer portions. The metallization layer defines a trench at second metallization layer portions. The liner includes is disposed to line the trench and includes liner sidewalls that have terminal edges that extend to the maximum post-deposition height and lie coplanar with the uppermost surface at the first metallization layer portions. The metallic interconnect is disposed on the liner to fill a trench remainder and has an uppermost interconnect surface that extends to the maximum post-deposition height and lies coplanar with the uppermost surface at the first metallization layer portions.