公开(公告)号：US20220009767A1

公开(公告)日：2022-01-13

申请号：US17487203

申请日：2021-09-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Marco CORSI ,  Barry Jon MALE

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

公开(公告)号：US20220189857A1

公开(公告)日：2022-06-16

申请号：US17120941

申请日：2020-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon MALE ,  Marco CORSI

IPC: H01L23/495 ,  H01L23/532 ,  H01L23/00

Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.

公开(公告)号：US20230089201A1

公开(公告)日：2023-03-23

申请号：US18052643

申请日：2022-11-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon MALE ,  Marco CORSI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/532

Abstract: In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.

公开(公告)号：US20190206806A1

公开(公告)日：2019-07-04

申请号：US15946868

申请日：2018-04-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon MALE ,  Paul Merle EMERSON ,  Kurt Peter WACHTLER

IPC: H01L23/00 ,  H01L23/34 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L23/562 ,  H01L23/29 ,  H01L23/345 ,  H01L23/49513 ,  H01L24/46 ,  H01L24/49 ,  H01L2924/14

Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.