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公开(公告)号：US20250125203A1
公开(公告)日：2025-04-17
申请号：US18999539
申请日：2024-12-23
Applicant: Texas Instruments Incorporated
Abstract: In some examples, a device comprises: a substrate having a cavity, the cavity having a bottom surface; a die pad in the cavity; and a semiconductor die in the cavity and having a first segment coupled to the die pad and a second segment suspended over and facing the bottom surface.
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公开(公告)号：US20230245935A1
公开(公告)日：2023-08-03
申请号：US17589405
申请日：2022-01-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
CPC classification number: H01L23/15 , H01L24/45 , H01L24/05 , H01L24/32 , H01L24/73 , H01L2224/05647 , H01L2224/45147 , H01L2224/04042 , H01L2224/32225 , H01L2224/73265
Abstract: In some examples, a device comprises a ceramic substrate having a cavity, a die pad in the cavity, and a semiconductor die in the cavity and having a first segment coupled to the die pad and a second segment cantilevered over a floor of the cavity. The device also includes a first conductive member in the cavity, the first conductive member coupled to a second conductive member exposed to an exterior of the ceramic substrate. The device also includes a bond wire coupled to a device side of the semiconductor die and to the first conductive member.
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公开(公告)号：US20190206806A1
公开(公告)日：2019-07-04
申请号：US15946868
申请日：2018-04-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon MALE , Paul Merle EMERSON , Kurt Peter WACHTLER
IPC: H01L23/00 , H01L23/34 , H01L23/495 , H01L23/29
CPC classification number: H01L23/562 , H01L23/29 , H01L23/345 , H01L23/49513 , H01L24/46 , H01L24/49 , H01L2924/14
Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.
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