公开(公告)号：US20190202684A1

公开(公告)日：2019-07-04

申请号：US15859184

申请日：2017-12-29

Applicant: Texas Instruments Incorporated

Inventor： Ganapathy Subramaniam Sivakumar ,  Chad Alan McKay

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/036 ,  B81C2203/0707

Abstract: In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

公开(公告)号：US11505451B2

公开(公告)日：2022-11-22

申请号：US16820477

申请日：2020-03-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ganapathy Subramaniam Sivakumar ,  Chad Alan McKay

IPC: B81B7/00 ,  B81C1/00

Abstract: In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

公开(公告)号：US20230064645A1

公开(公告)日：2023-03-02

申请号：US18047302

申请日：2022-10-18

Applicant: Texas Instruments Incorporated

Inventor： Ganapathy Subramaniam Sivakumar ,  Chad Alan McKay

IPC: B81B7/00 ,  B81C1/00

Abstract: In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.

公开(公告)号：US20200216306A1

公开(公告)日：2020-07-09

申请号：US16820477

申请日：2020-03-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ganapathy Subramaniam Sivakumar ,  Chad Alan McKay

IPC: B81B7/00 ,  B81C1/00

Abstract: In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.