公开(公告)号：US20200168534A1

公开(公告)日：2020-05-28

申请号：US16202663

申请日：2018-11-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas Dyer BONIFIELD ,  Sreeram Subramanyam NASUM ,  Robert H. EKLUND ,  Jeffrey Alan WEST ,  Byron Lovell WILLIAMS ,  Elizabeth Costner STEWART

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: In some examples, a multi-chip module (MCM), comprises a first and a second die-attach pad (DAP); a first die comprising a first set of microelectronic devices; a second die comprising a first capacitor and a second capacitor; and a third die comprising a second set of microelectronic devices, where the first and second dies are positioned on the first DAP, and the third die is positioned on the second DAP. The first set of microelectronic devices couples to the first capacitor via a first inter-die connection and the second set of microelectronic devices couples to the second capacitor via a second inter-die connection.