POWER MODULE WITH FLAT COPPER WINDING
    2.
    发明公开

    公开(公告)号:US20240347267A1

    公开(公告)日:2024-10-17

    申请号:US18299830

    申请日:2023-04-13

    CPC classification number: H01F27/40 H01F27/06 H01F27/24 H01F27/29 H01F41/04

    Abstract: An apparatus includes a magnetic core and an inductor. The magnetic core has a cylindrical boss and a base plate. The cylindrical boss has a first end and a second end. The base plate extends perpendicularly from the first end of the cylindrical boss. The base plate has a top side and a bottom side. The inductor includes a coil, a first terminal, and a second terminal. The coil is disposed on the top side of the base plate about the cylindrical boss. The first terminal is wrapped from the top side of the base plate to the bottom side of the base plate. The second terminal is wrapped from the top side of the base plate to the bottom side of the base plate.

    POWER MODULE WITH ENHANCED HEAT DISSIPATION

    公开(公告)号:US20220208662A1

    公开(公告)日:2022-06-30

    申请号:US17139571

    申请日:2020-12-31

    Abstract: In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.

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