公开(公告)号：US20220415760A1

公开(公告)日：2022-12-29

申请号：US17903709

申请日：2022-09-06

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/82 ,  H01L23/31 ,  H01L23/64

Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.

公开(公告)号：US20220068790A1

公开(公告)日：2022-03-03

申请号：US17525412

申请日：2021-11-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/50 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.

公开(公告)号：US10854538B2

公开(公告)日：2020-12-01

申请号：US16273148

申请日：2019-02-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/522 ,  H01L23/64 ,  H01L23/31

Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.

公开(公告)号：US20200258820A1

公开(公告)日：2020-08-13

申请号：US16273148

申请日：2019-02-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.

公开(公告)号：US20210082794A1

公开(公告)日：2021-03-18

申请号：US17108920

申请日：2020-12-01

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/522 ,  H01L23/64 ,  H01L23/31

Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.

公开(公告)号：US20200294906A1

公开(公告)日：2020-09-17

申请号：US16892066

申请日：2020-06-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/50 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.

公开(公告)号：US20200258819A1

公开(公告)日：2020-08-13

申请号：US16273152

申请日：2019-02-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/82

Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.