公开(公告)号：US20220068790A1

公开(公告)日：2022-03-03

申请号：US17525412

申请日：2021-11-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/50 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.

公开(公告)号：US11699649B2

公开(公告)日：2023-07-11

申请号：US17525412

申请日：2021-11-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  J K Ho

IPC: H01L21/00 ,  H01L23/50 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/50 ,  H01L23/28 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/49 ,  H01L2924/14

Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.

公开(公告)号：US20220415760A1

公开(公告)日：2022-12-29

申请号：US17903709

申请日：2022-09-06

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/82 ,  H01L23/31 ,  H01L23/64

Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.

公开(公告)号：US11444012B2

公开(公告)日：2022-09-13

申请号：US16831503

申请日：2020-03-26

Applicant: Texas Instruments Incorporated

Inventor： Yuh-Harng Chien ,  Chang-Yen Ko ,  Chih-Chien Ho

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.

公开(公告)号：US11437303B2

公开(公告)日：2022-09-06

申请号：US16273152

申请日：2019-02-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  J K Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/82 ,  H01L23/31 ,  H01L23/64

Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.

公开(公告)号：US11183450B2

公开(公告)日：2021-11-23

申请号：US16892066

申请日：2020-06-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chang-Yen Ko ,  J K Ho

IPC: H01L21/00 ,  H01L23/50 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00

Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.

公开(公告)号：US20210305139A1

公开(公告)日：2021-09-30

申请号：US16831503

申请日：2020-03-26

Applicant: Texas Instruments Incorporated

Inventor： Yuh-Harng Chien ,  Chang-Yen Ko ,  Chih-Chien Ho

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00

Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.

公开(公告)号：US20190385899A1

公开(公告)日：2019-12-19

申请号：US16550834

申请日：2019-08-26

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien HO

IPC: H01L21/762 ,  H01L23/00 ,  H05K3/38 ,  H01L21/306

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US11935789B2

公开(公告)日：2024-03-19

申请号：US17903709

申请日：2022-09-06

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  J K Ho

IPC: H01L21/82 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/64

CPC classification number: H01L21/82 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/09 ,  H01L24/17 ,  H01L24/33 ,  H01L24/49 ,  H01L24/73

Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.

公开(公告)号：US10854538B2

公开(公告)日：2020-12-01

申请号：US16273148

申请日：2019-02-12

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  JK Ho

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/522 ,  H01L23/64 ,  H01L23/31

Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.