公开(公告)号：US20250140735A1

公开(公告)日：2025-05-01

申请号：US18498126

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jomari AUSTRIA ,  Ray Fredric DE ASIS ,  Jeffrey Salvacion SOLAS

IPC: H01L23/00

Abstract: A package comprises a semiconductor die including a device side having circuitry formed therein. The package includes a metal member coupled to the device side and a nanotwin copper member having a bottom surface coupled to the metal member, the nanotwin copper member comprising a twin boundary separating a first region having a first grain structure from a second region having a second grain structure. The package also comprises a wire bond coupled directly to a top surface of the nanotwin copper member, the wire bond contacting multiple regions of the nanotwin copper member. The package also comprises a mold compound covering the die, the metal member, the nanotwin copper member, and the wire bond.