公开(公告)号：US20230047555A1

公开(公告)日：2023-02-16

申请号：US17400913

申请日：2021-08-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： KEN PHAM, JR. ,  VIVEK ARORA ,  WOOCHAN KIM

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: This description relates generally to semiconductor devices and processes. A method for forming a packaged semiconductor package can include attaching a front side of a metal layer to a die pad of a leadframe that includes conductive terminals, so a periphery portion of the metal layer extends beyond a periphery pad surface of the die pad, and a portion of a half-etched cavity on the front side of the metal layer is located near the periphery pad surface of the die pad. The method further includes attaching a semiconductor device to the die pad and encapsulating the semiconductor device, the front side of the metal layer, a portion of a back side of the metal layer, and a portion of the conductive terminals to form a packaged semiconductor device.