公开(公告)号：US20200273720A1

公开(公告)日：2020-08-27

申请号：US16802819

申请日：2020-02-27

Applicant: Texas Instruments Incorporated

Inventor： Leon Stiborek

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56

Abstract: A method includes removing an oxide layer from select areas of a surface of a metal structure of a lead frame to create openings that extend through the oxide layer to expose portions of the surface of the metal structure. The method further includes attaching a semiconductor die to the lead frame, performing an electrical connection process that electrically couples an exposed portion of the surface of the metal structure to a conductive feature of the semiconductor die, enclosing the semiconductor die in a package structure, and separating the electronic device from the lead frame. In one example, the openings are created by a laser ablation process. In another example, the openings are created by a chemical etch process using a mask. In another example, the openings are created by a plasma process.

公开(公告)号：US11271296B2

公开(公告)日：2022-03-08

申请号：US16181627

申请日：2018-11-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Leon Stiborek ,  Alexey Berd ,  Daniel Lee Revier

IPC: H01Q1/38 ,  H01Q13/16 ,  H01Q1/40 ,  H01Q1/24 ,  H01Q9/04

Abstract: An antenna includes a metal member having a surface that includes a slot. The metal member includes a plurality of legs orthogonal to the surface of the metal member. The plurality of legs are configured to be attached to a circuit board. A first dielectric material is in the slot.