公开(公告)号：US12283559B2

公开(公告)日：2025-04-22

申请号：US18071288

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lin Zhang ,  Huo Yun Duan ,  Xi Lin Li ,  Chen Xiong ,  Xiao Lin Kang

IPC: H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

公开(公告)号：US20230086535A1

公开(公告)日：2023-03-23

申请号：US18071288

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lin Zhang ,  Huo Yun Duan ,  Xi Lin Li ,  Chen Xiong ,  Xiao Lin Kang

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

公开(公告)号：US11515275B2

公开(公告)日：2022-11-29

申请号：US16941701

申请日：2020-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lin Zhang ,  Huo Yun Duan ,  Xi Lin Li ,  Chen Xiong ,  Xiao Lin Kang

IPC: H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

公开(公告)号：US20210313291A1

公开(公告)日：2021-10-07

申请号：US16941701

申请日：2020-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lin Zhang ,  Huo Yun Duan ,  Xi Lin Li ,  Chen Xiong ,  Xiao Lin Kang

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.