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公开(公告)号：US11636242B2
公开(公告)日：2023-04-25
申请号：US17245253
申请日：2021-04-30
IPC分类号： G06F30/27 , G06F30/367 , G06N3/08 , G06N20/00 , G06N3/084 , G06F30/398 , G06F30/337 , G06F30/392 , G06N20/20 , G06F30/373 , G06F30/3308 , G06F18/2415 , G06N3/045 , G06F111/20 , G06F111/04
摘要： A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号：US11748533B2
公开(公告)日：2023-09-05
申请号：US17245057
申请日：2021-04-30
IPC分类号： G06F30/27 , G06F30/3308 , G06N3/084 , G06F30/398 , G06F30/337 , G06F30/392 , G06N20/00 , G06N3/08 , G06N20/20 , G06F30/367 , G06F30/373 , G06F18/2415 , G06N3/045 , G06F111/20 , G06F111/04
CPC分类号： G06F30/27 , G06F18/24155 , G06F30/337 , G06F30/3308 , G06F30/367 , G06F30/373 , G06F30/392 , G06F30/398 , G06N3/045 , G06N3/08 , G06N3/084 , G06N20/00 , G06N20/20 , G06F2111/04 , G06F2111/20
摘要： A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号：US11797732B2
公开(公告)日：2023-10-24
申请号：US17245000
申请日：2021-04-30
IPC分类号： G06F30/27 , G06F30/392 , G06N3/084 , G06F30/398 , G06F30/337 , G06N20/00 , G06N3/08 , G06N20/20 , G06F30/367 , G06F30/373 , G06F30/3308 , G06F18/2415 , G06N3/045 , G06F111/20 , G06F111/04
CPC分类号： G06F30/27 , G06F18/24155 , G06F30/337 , G06F30/3308 , G06F30/367 , G06F30/373 , G06F30/392 , G06F30/398 , G06N3/045 , G06N3/08 , G06N3/084 , G06N20/00 , G06N20/20 , G06F2111/04 , G06F2111/20
摘要： A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号：US11727175B2
公开(公告)日：2023-08-15
申请号：US17245022
申请日：2021-04-30
IPC分类号： G06F30/27 , G06F30/392 , G06N3/084 , G06F30/398 , G06F30/337 , G06N20/00 , G06N3/08 , G06N20/20 , G06F30/367 , G06F30/373 , G06F30/3308 , G06F18/2415 , G06N3/045 , G06F111/20 , G06F111/04
CPC分类号： G06F30/27 , G06F18/24155 , G06F30/337 , G06F30/3308 , G06F30/367 , G06F30/373 , G06F30/392 , G06F30/398 , G06N3/045 , G06N3/08 , G06N3/084 , G06N20/00 , G06N20/20 , G06F2111/04 , G06F2111/20
摘要： A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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