公开(公告)号：US20220029664A1

公开(公告)日：2022-01-27

申请号：US17293427

申请日：2019-10-23

Applicant: THALES

Inventor： Cédric BAUDOIN ,  Sandra VIME ,  Bertrand ONILLON ,  Hélène GACHON ,  Cécile LARUE DE TOURNEMINE ,  Philippe VOISIN

IPC: H04B7/024 ,  H04B7/185 ,  H04B7/204

Abstract: A method for estimating, at one and the same given time, a set of attenuations of one or more first radiofrequency RF uplinks, implemented by a VHTS space telecommunications system. In an auxiliary usage step, an on-board regenerative or digital transparent processor DTP generates at least one beacon signal that is or are distributed, in the Q band, to N nominal access stations GWn(i) in order to be measured in terms of power, or measures the spectral power of each traffic signal transmitted by the nominal access stations GWn(i), i varying from 1 to N. In a following step, the attenuation levels An(i) of the uplinks LUn(i) are determined based on the powers of the one or more beacon signals that are measured on the corresponding downlinks LDn(i) in the Q band, or based on the one or more spectral powers, measured by the DTP, of the traffic signals received on the one or more uplinks LUn(i).

公开(公告)号：US20180341604A1

公开(公告)日：2018-11-29

申请号：US15987663

申请日：2018-05-23

Applicant: THALES

Inventor： Hélène GACHON ,  Norbert VENET

IPC: G06F13/20 ,  G06F13/40 ,  H04B10/80 ,  H05K7/20 ,  G02B6/44 ,  B64G1/66

Abstract: A digital processing device with high input/output connectivity and modular architecture comprises a first plurality of input ports, a second plurality of output ports, and a third plurality of at least four basic elementary modules. The third plurality of the elementary modules is split up according to a partitioning of at least two sub-assemblies of module(s), at least two of which form different islets comprising at least two modules. The digital processing device comprises a harness of optical links for mutually interconnecting the sub-assemblies of modules whose interconnection lengths are compatible with interconnection runs between two interconnected islets which make it possible to avoid, by sidestepping, one or more items of equipment external to the digital processing device, and which are installed on a space platform and interposed between the two interconnected islets, or which make it possible to distribute at least two interconnected islets over two heat exchange zones of the space platform that are far separated by a separation distance on the scale of the size of the platform.