公开(公告)号：US20200331639A1

公开(公告)日：2020-10-22

申请号：US16913855

申请日：2020-06-26

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham NaroII Gissen ,  Miguel A. Estevez

IPC: B64G1/50 ,  F28D21/00 ,  H05K7/20 ,  H01L23/427 ,  H01L23/42 ,  F28F13/00 ,  H01L23/373

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

公开(公告)号：US20180305043A1

公开(公告)日：2018-10-25

申请号：US15494315

申请日：2017-04-21

Applicant: THE BOEING COMPANY

Inventor： Eric S. Mindock ,  James H. Mabe ,  Frederick Theodore Calkins ,  Abraham NaroII Gissen ,  Miguel A. Estevez

IPC: B64G1/50 ,  F28D21/00 ,  F28F21/08 ,  H05K7/20

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.