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公开(公告)号：US10730645B2
公开(公告)日：2020-08-04
申请号：US15494315
申请日：2017-04-21
Applicant: THE BOEING COMPANY
Inventor： Eric S. Mindock , James H. Mabe , Frederick Theodore Calkins , Abraham Naroll Gissen , Miguel A. Estevez
IPC: H05K7/20 , F28F13/00 , F28F21/00 , B64G1/50 , F28D21/00 , H01L23/427 , H01L23/42 , H01L23/373
Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
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公开(公告)号：US20200047875A1
公开(公告)日：2020-02-13
申请号：US16100412
申请日：2018-08-10
Applicant: The Boeing Company
Inventor： Frederick Theodore Calkins , Douglas E. Nicholson , Jordan Kreitzman
IPC: B64C21/08
Abstract: Variably porous panels and panel assemblies incorporating shape memory alloy components along with methods for actuating the shape memory alloys are disclosed to predictably alter the porosity of a substrate surface, with the shape memory alloy maintained in an orientation relative to the panel that is in-plane with a mold-line of the panel outer surface.
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公开(公告)号：US20200331639A1
公开(公告)日：2020-10-22
申请号：US16913855
申请日：2020-06-26
Applicant: THE BOEING COMPANY
Inventor： Eric S. Mindock , James H. Mabe , Frederick Theodore Calkins , Abraham NaroII Gissen , Miguel A. Estevez
IPC: B64G1/50 , F28D21/00 , H05K7/20 , H01L23/427 , H01L23/42 , F28F13/00 , H01L23/373
Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
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公开(公告)号：US20180305043A1
公开(公告)日：2018-10-25
申请号：US15494315
申请日：2017-04-21
Applicant: THE BOEING COMPANY
Inventor： Eric S. Mindock , James H. Mabe , Frederick Theodore Calkins , Abraham NaroII Gissen , Miguel A. Estevez
Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
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5.发明申请公开(公告)号：US20190257599A1
公开(公告)日：2019-08-22
申请号：US15901779
申请日：2018-02-21
Applicant: The Boeing Company
Inventor： David W. Foutch , Frederick Theodore Calkins
IPC: F28F27/00 , G05D23/185 , G05D23/275 , F28F13/00
Abstract: Thermal management systems incorporating shape memory alloy (SMA) actuators and related methods. A thermal management system includes a heat transfer region, a process fluid conduit, a thermal management fluid conduit, and an SMA actuator assembly. The SMA actuator assembly includes an SMA element coupled to an actuation element, which is configured to assume a position among a plurality of positions defined between a restrictive position and an open position. The position of the actuation element is based, at least in part, on a conformation of the SMA element. A method of passively regulating a temperature of a process fluid includes conveying a process fluid stream in heat exchange relation with an SMA element, transitioning the SMA element to assume a conformation, flowing each of the process fluid stream and a thermal management fluid stream through a heat transfer region, and modulating a flow rate of the thermal management fluid stream.
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Patent Agency Ranking
公开(公告)号：US20250059960A1
公开(公告)日：2025-02-20
申请号：US18469599
申请日：2023-09-19
Applicant: The Boeing Company
Inventor： Christopher R. Shurilla , Zackary L. Endsley , John C. Mooney , Steven Fulton Griffin , Alexander C. Klein , Frederick Theodore Calkins
IPC: F03G7/06
Abstract: A deployable panel is provided comprising a first subpanel, a second subpanel, and a shape memory alloy hinge connecting the subpanels. The shape memory alloy hinge enables the subpanels to move between a position in which the first and second subpanels are folded over each other and an unfolded position in response to an energy source that changes the shape of the shape memory alloy hinge, wherein the unfolded position is trained into the shape memory alloy hinge to ensure precise kinematic mating between the subpanels. Shape memory alloy springs are connected to the first subpanel and respective tethers connect the shape memory alloy springs to the second subpanel. The shape memory alloy springs contract in response to a second energy source to pull the subpanels together via the tethers when the subpanels are in the unfolded position to produce a seamless, featureless surface of the deployable panel.
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公开(公告)号：US11225339B2
公开(公告)日：2022-01-18
申请号：US16913855
申请日：2020-06-26
Applicant: THE BOEING COMPANY
Inventor： Eric S. Mindock , James H. Mabe , Frederick Theodore Calkins , Abraham Naroll Gissen , Miguel A. Estevez
IPC: H05K7/20 , B64G1/50 , F28D21/00 , H01L23/427 , H01L23/42 , F28F13/00 , H01L23/373
Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
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公开(公告)号：US10934021B2
公开(公告)日：2021-03-02
申请号：US16174472
申请日：2018-10-30
Applicant: The Boeing Company
Inventor： James Henry Mabe , Frederick Theodore Calkins , Stephen K. Kirchmeier , Edward Andrew Whalen , Donald William Ruhmann
IPC: B64F5/10
Abstract: A method for aligning and joining a first structure to a second structure in an aircraft is provided. A spacer system having a shape memory alloy is positioned in a gap between the first structure and the second structure. The shape memory alloy is initially in a cooled state. A temperature of the shape memory alloy is increased such that the shape memory alloy changes from the cooled shape to a heated shape to fill the gap and apply a load to hold the first structure in place relative to the second structure. Additional processes may then be performed to join the first structure to the second structure.
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公开(公告)号：US12228114B1
公开(公告)日：2025-02-18
申请号：US18469599
申请日：2023-09-19
Applicant: The Boeing Company
Inventor： Christopher R. Shurilla , Zackary L. Endsley , John C. Mooney , Steven Fulton Griffin , Alexander C. Klein , Frederick Theodore Calkins
Abstract: A deployable panel is provided comprising a first subpanel, a second subpanel, and a shape memory alloy hinge connecting the subpanels. The shape memory alloy hinge enables the subpanels to move between a position in which the first and second subpanels are folded over each other and an unfolded position in response to an energy source that changes the shape of the shape memory alloy hinge, wherein the unfolded position is trained into the shape memory alloy hinge to ensure precise kinematic mating between the subpanels. Shape memory alloy springs are connected to the first subpanel and respective tethers connect the shape memory alloy springs to the second subpanel. The shape memory alloy springs contract in response to a second energy source to pull the subpanels together via the tethers when the subpanels are in the unfolded position to produce a seamless, featureless surface of the deployable panel.
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公开(公告)号：US11286042B2
公开(公告)日：2022-03-29
申请号：US16100412
申请日：2018-08-10
Applicant: The Boeing Company
Inventor： Frederick Theodore Calkins , Douglas E. Nicholson , Jordan Kreitzman
Abstract: Variably porous panels and panel assemblies incorporating shape memory alloy components along with methods for actuating the shape memory alloys are disclosed to predictably alter the porosity of a substrate surface, with the shape memory alloy maintained in an orientation relative to the panel that is in-plane with a mold-line of the panel outer surface.
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